Mfr Package Description | PLASTIC, DIP-64 |
Microprocessor/Microcontroller/Peripheral IC Type | MICROPROCESSOR |
Address Bus Width | 23.0 |
Bit Size | 32 |
Boundary Scan | NO |
Clock Frequency-Max | 8.0 MHz |
External Data Bus Width | 16.0 |
Format | FIXED POINT |
Integrated Cache | NO |
JESD-30 Code | R-PDIP-T64 |
JESD-609 Code | e0 |
Low Power Mode | NO |
Number of DMA Channels | 0.0 |
Number of External Interrupts | 7.0 |
Number of Serial I/Os | 0.0 |
Number of Terminals | 64 |
On Chip Data RAM Width | 0 |
Operating Temperature-Min | 0.0 Cel |
Operating Temperature-Max | 70.0 Cel |
Package Body Material | PLASTIC/EPOXY |
Package Code | DIP |
Package Shape | RECTANGULAR |
Package Style | IN-LINE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Qualification Status | Not Qualified |
RAM (words) | 0 |
Seated Height-Max | 5.84 mm |
Speed | 8.0 MHz |
Supply Current-Max | 25.0 mA |
Supply Voltage-Nom | 5.0 V |
Supply Voltage-Min | 4.75 V |
Supply Voltage-Max | 5.25 V |
Surface Mount | NO |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | THROUGH-HOLE |
Terminal Pitch | 2.54 mm |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Length | 81.535 mm |
Width | 22.86 mm |
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